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Title page for etd-0120109-105537


URN etd-0120109-105537 Statistics This thesis had been viewed 1822 times. Download 4 times.
Author Kuo-Chuan Chen
Author's Email Address No Public.
Department Mechanical Engineering
Year 2008 Semester 1
Degree Master Type of Document Master's Thesis
Language zh-TW.Big5 Chinese Page Count 93
Title Effect of Channel Arrangement on the Performance of Liquid Cooling System
Keyword
  • Liquid Cooling
  • Liquid Cooling
  • Abstract In recent years, the performance of electronic system has advanced steadily with the progress of semiconductor technology. Overheating has also become more and more serious. In order to solve this problem many forms of heat dissipation have been developed. The water cooling system is one of the numerous research aspects.
    This article uses the electronic heat distribution analysis software Icepak to do the numerical simulation. It analyzes the effects of the fin piece distance, dimensions, flow channel depth, copper plate thickness, and other factors on the nature of the water block’s heat dissipation. Then, the water block sample is prepared, and put inside the temperature and humidity testing chamber to test its thermal resistance value, and compared with results from the simulation.
    Research shows that when the environmental factors, water outlet inlet distance, current capacity, exterior dimensions, canal width of 4.25mm, canal base and heat source distance of 2.5mm of the copper plates are nearly the same in both the simulation and actual test. The heat dissipation is most effective when canal distance is 1.75mm, and worst when it’s 0.5mm.
    For plates with the same environmental factors, water outlet inlet distance, current capacity, exterior dimensions, heat dissipation is best in case of canal base and heat source are 2.5mm apart, and canal is 11mm deep. It is worst when canal base and heat source are 1.5mm apart, and canal is 12mm deep.
    For the same environmental factors, water outlet inlet distance, current capacity, and distance between canal base and heat source, it is found that increase in the contact area between the water block interior and water is advantageous to heat dissipation.
    For the same the same current capacity arrangement under the water block, it is found that heat dissipation is best when canal base is 4mm apart from heat source and fin piece is 4mm high.
    For the same environmental factors, current capacity, exterior dimensions of the copper plates, it is found that heat dissipation is best when canal base is 5.5mm apart from heat source, and fin piece is 13.5mm high
    Advisor Committee
  • Hong-Sen Kou - advisor
  • Ji-Jen Lee - advisor
  • Files indicate not accessible
    Date of Defense 2008-12-15 Date of Submission 2009-01-20


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