Announcement for Downloading full text filePlease respect the Copyright Act.
All digital full text dissertation and theses from this website are authorized the copyright owners. These copyrighted full-text dissertation and theses can be only used for academic, research and non-commercial purposes. Users of this website can search, read, and print for personal usage. In respect of the Copyright Act of the Republic of China, please do not reproduce, distribute, change, or edit the content of these dissertations and theses without any permission. Please do not create any work based upon a pre-existing work by reproduction, Adaptation, Distribution or other means.
URN etd-0705110-144913 Statistics This thesis had been viewed 2614 times. Download 2628 times. Author Shu-Hong Chu Author's Email Address firstname.lastname@example.org Department Mechanical Engineering Year 2009 Semester 2 Degree Master Type of Document Master's Thesis Language zh-TW.Big5 Chinese Page Count 62 Title Thermal Management of a Networking
Equipment by Numerical Simulation
Keyword electronic cooling networking equipment numerical simulation numerical simulation networking equipment electronic cooling Abstract With the development of information technology industry in recent years, it has entered the global information age. The demands for network with high speed and good reliability are to be particular, especially for the enterprise end user. While upgrading the performance of the equipment, however, it would be unstable or shut down if the thermal management is not appropriate. Thus, the importance of electronic cooling is to be highlighted.
In general, the timing allowed in the development of an electronic product is limited. Therefore, to find a correct and effective solution in thermal management is not easily. In the early stage, the trial and error method is not only wasting time, but also with higher cost. Using CFD software as the tool of thermal simulation, the purpose of this study is to decrease the risk of project failure and also to focus on the time and cost considerations. It is anticipated that the operating temperature of all components can work in their specifications.
The study will use the 1U networking equipment as an example to integrate the hardware layout, thermal source distribution, fan disposition, air flow, etc. and then using FloTHERM V6.1 to predict thermal simulation of a whole system. All the boundary conditions base on the product are specified to proceed with the optimization. Finally, this study performs an actual measurement of equipment to verify the simulation result.
According to the comparison of the numerical simulation and experimental measurement, the conclusions are summarized as follows. Using CFD software FloTHERM as a numerical simulation tool can grasp and predict all the trends of thermal management. Even though there is the error within 5% existing in the simulation result, the simulation result can provide a thermal trend for reference with a high level of accuracy. This study assumed four cases of fan layout, Case 1（four dual-fan）shows the best result in the distribution of temperature field where there is no obvious heat detention in Case 1. Also, the temperature values of Case 1 are lower than other three Cases about 3 ℃. Regarding to the thermal distribution, the main heat source of networking equipment come out from MAC（this study BCM56820）and PHY（this study U2-U9）and hence they are placed on the maximum air flow region. Both the simulation result and actual measurement show that to place the main heat source on the maximum air flow region will not only obtain a better performance but also save the cost of heat sink.
To aim at the root cause of the errors between the simulation and actual measurement results, the study summarized as below：1) To save the computation time, the 3D model and the grids are simplified. 2) The maximum error appears on DDR module. Because there are eight chips on this module, the chips are not operating at the same time but operating one by one. 3) Since the contact between the chip surface and heat sink is perfect in simulation, but actually, it is using thermal grease or thermal pad which are with a lower value to solve the contact resistance issue. Hence, the simulation results are better than the actual measurement data.
Advisor Committee Hong-Sen Kou - advisor
Files Date of Defense 2010-06-11 Date of Submission 2010-07-06