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URN etd-0716107-150555 Statistics This thesis had been viewed 3162 times. Download 2978 times. Author Chih-Hung Shen Author's Email Address No Public. Department Mechanical Engineering Year 2006 Semester 2 Degree Master Type of Document Master's Thesis Language zh-TW.Big5 Chinese Page Count 87 Title Study on the influence of forming process to heat pipe’s performance Keyword heat pipe maximum heat transfer wick structure wick structure maximum heat transfer heat pipe Abstract ABSTRACT
Heat pipe use of liquid and vapor. Two phase flow heat transfer, has been exercised in electronic cooling since 90’s. The mean study of thesis is to find out the performance curve after heat pipe forming process. Tracking the decayed range of heat pipe by a series of the related experiments. Build up the experimental trend as an engineering reference for designing thermal module of electronic components.
The research is to focus on the effect of heat pipe forming process including flatting, bending and both . The influence of deform about different wick structure (mesh, groove and powder ) of heat pipe , and different diameter (Ф4, Ф5 and Ф6 ) heat pipe’s forming limits of performance are also analyzed.
In this study, three parameter of heat transfer is detected. They are ΔT (2 points temperature difference), Qmax (Maximum Heat Transfer) and Q” max (Maximum Heat Flux). Comparison of each result is carried to get the deformation effects on heat pipe before and after.
The result of experiment shows that the mesh structure will support better flatting limits, eachψ4, ψ5 andψ6 mesh pipe can press to 2.0 mm thickness, but groove and powder type just support 2.5 mm deformation. About the bending , the groove and powder type will tolerate the smaller bending radius (Rc) in each different heat pipe diameter on the contrary. When both two processes are applied on the performance will be decreased for bending angle (θ) less than 90 degree.
Advisor Committee Hong-Sen Kou - advisor
Ji-Jen Lee - advisor
Files Date of Defense 2007-06-21 Date of Submission 2007-07-16