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The defense date of the thesis is 2010-07-16
The current date is 2019-07-18
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URN etd-0716110-160650 Statistics This thesis had been viewed 2836 times. Download 8 times. Author kuo-wen pin Author's Email Address No Public. Department Industrial Design Year 2009 Semester 2 Degree Master Type of Document Master's Thesis Language zh-TW.Big5 Chinese Page Count 92 Title A Study of the Double Injection Molding - Notebook Computer as Examples Keyword double injection mold injection technology injection technology mold double injection Abstract The purpose of this study is to address the problems of PC + ABS (Thermoplastics plastics) and TPU (Thermoplastics Urethane), using double injection molding method, in today’s notebook computers. This study will focus on notebook computer top cover-the appearance part of the structure and the LCD back cover plastic injection molded parts. In the mold development process, possible problems of warpage and places where finished abnormally to be explored and the adhesion between current use industrial plastic and elastomer to be analyzed in order to improving the molding process efficiency and product quality while reducing cost. It is an up rising technology that the notebook computer business is expecting to be developed.
However, research in this regard was yet to be fully developed. For the computer case in this study will cover the use of PC + ABS (BAYER DP3008) and TPU (AVAON TPU80AT(U)) double injection molding. The problems arising from mold development stage to the tryout and mass production were described and studied in detail, and issues were resolved leading to a smooth production.
The results will provide a reference for future design of similar attempt to establish a set of guidelines developed through the experience of technology integration, CAD / CAM / CAE applications to carry out the actual mold development and contribute to future education and training in new product development.
Advisor Committee Chih-Yuan Lo - advisor
Fu-Yuan Lee - co-chair
none - co-chair
Files Date of Defense 2010-06-28 Date of Submission 2010-07-16