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URN etd-0721105-105449 Statistics This thesis had been viewed 3284 times. Download 1828 times. Author Chih-Wei Hung Author's Email Address email@example.com Department Materials Engineering Year 2005 Semester 2 Degree Master Type of Document Master's Thesis Language English Page Count 103 Title The Manufacture and Investigation of Electroless Copper Deposited Polyacrylontrile (PAN) Nano
Composites for EMI Shielding
Keyword nano electromangetic interfence Electroless copper Electroless copper electromangetic interfence nano Abstract Abstract
In this investigation, the electroless plating method was used to plate the Cu31S16 and Cu2-xS on the surface and inner of the polyacrylontrile (PAN) for electromagnetic interference (EMI) shielding. In this plating procedure, the PAN film was swollen before electroless plating without sensitizing and activating pretreatment.
Effects of operating parameters, cupric ion concentration and swelling pretreatment on the EMI (Electromagnetic Interference) shielding effectiveness (SE) were investigated. The EMI SE, surface morphology, cross section morphology, particles size inner the substrate, element of the layer and inner the substrate, thermal properties and antibacterial character of nano polymeric composites were detected by EMI, FE-SEM, HP-XRD, HR-TEM with EDX, EDS, DSC, AFM and antibacterial test analyzer, respectively.
Experimental results revealed that the EMI shielding effectiveness of Cu31S16-PAN composites reached 18~20 dB when the plating temperature was 95℃ and plating time was 1 hour with cupric ion 0.48M, However, the EMI shielding effectiveness of composite reached 30~35 dB the PAN was pre-swelled before plating. HP-XRD analysis shows that the Cu31S16 was deposited on the PAN surface after the electroless copper plating procedure. In addition, AFM also shows that the Cu31S16 deposited on the PAN surface obviously. The surface morphology of Cu31S16-PAN and Cu31S16-SPAN were studied by FE-SEM. The grains shapes were likeness irregular and sharp on the substrate surface and the most thickness of the plating layer was about 200 nm. HR-TEM shows that the particles size of Cu2-xS compound distributed from 6 to 30 nm inner the SPAN substrate and the main particles size were about 15 to 20 nm. These nano polymeric composites possessed antibacterial character.
Advisor Committee Chi-Yuan Huang - advisor
Jant-Ten Yeh - co-chair
Kan-Nan Chien - co-chair
Ko-Shao Chien - co-chair
Wen-Yen Chiang - co-chair
Files Date of Defense 2005-07-15 Date of Submission 2005-07-21