首頁 > 網路資源 > 大同大學數位論文系統

Title page for etd-0723107-105031


URN etd-0723107-105031 Statistics This thesis had been viewed 1525 times. Download 8 times.
Author Shuo-Hung Chien
Author's Email Address No Public.
Department Materials Engineering
Year 2006 Semester 2
Degree Master Type of Document Master's Thesis
Language English Page Count 94
Title Preparation and Investigation of Electroless Plating Silver on Nylon 6 for EMI Shielding
Keyword
  • Electroless plating
  • EMI Shielding
  • EMI Shielding
  • Electroless plating
  • Abstract In this investigation, the electroless Ag polyamide (Nylon) was produced by electroless plating. Nylon must be pretreated (swelling, Iodinate, sensitize, activation) before electroless plating, then electroless silver method was used to plate the silver in the chain or surface of Nylon film. The electromagnetic interference (EMI) shielding effectiveness (SE) of Ag-Nylon composition would achieved by the silver plating of appearance.
    In electroless process, pretreatment of Iodinate and swelling were chosen as key point as affections of adhesion between matrix and silver plating. Meanwhile, the influences of electroless method between ultrasonic vibration and magnetic stirring for electromagnetic interference (EMI) shielding effectiveness (SE) were investigated. Additionally, weight analysis of deposition time, surface morphology, adhesion test, thermal properties, elements of plating of polymeric composites were detected by SEM, FE-SEM, DSC, XRD, EDS, EMI measurements, respectively.
    The results revealed that different electroless method would obtain different EMI shielding effectiveness. The EMI shielding effectiveness of Ag-Nylon composite would reach about 25~30dB when using electroless method of magnetic stirring, however, the EMI shielding effectiveness of composite would reach 50~55dB when using electroless method of ultrasonic vibration. EDS shows the element analysis of plating was simple Ag that has higher electric conductivity was about 63.01 × 106 S/m.
    Adhesion testing and surface morphology of SEM show that pretreatment of Iodinate Nylon would improve adhesion between silver plating and Nylon matrix. Electroless silver process without pretreatment of iodinate, swelling would not obtain better adhesion. SEM analysis shows that stacking silver particles would increase on the surface of Nylon when the deposition time was increased. Agglomeration of silver particles would densely packed with increasing deposition time and the smallest silver particles were observed about 1 to 3μm. DSC and XRD analysis show that Nylon would obtain different crystalline structure after pretreatment of swelling and iodinate. The EMI shielding effectiveness of electroless silver Nylon would increase with increasing the content of KBr, and the highest dB value (55~60dB) would obtain by adding 0.052g of KBr.
    Advisor Committee
  • Chi-Yuan Huang - advisor
  • Files indicate in-campus access only
    Date of Defense 2007-06-22 Date of Submission 2007-07-23


    Browse | Search All Available ETDs