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Title page for etd-0808106-013322


URN etd-0808106-013322 Statistics This thesis had been viewed 3185 times. Download 1854 times.
Author Chien-I Ho
Author's Email Address No Public.
Department Materials Engineering
Year 2005 Semester 2
Degree Master Type of Document Master's Thesis
Language English Page Count 90
Title The Influence of Size on the Thermal Performance of Flat Plate Heat Pipe
Keyword
  • wick structure
  • thermal resistance
  • flat plate heat pipe
  • flat plate heat pipe
  • thermal resistance
  • wick structure
  • Abstract The influence of size on the thermal performance of flat plate heat pipe has been studied. Three flat plate heat pipes in different size was chosen to match the size of heat sink and compared each other. The heating area (evaporator section) of flat plate heat pipe (FPHP) made the discussion, the experimental results show the thermal resistance value of large-size (8370 mm2) less than that of small-size (2773 mm2). When some area of condenser section of flat plate heat pipe did not contact heat sink, the heat can’t be take the away effectively. For the sake of heat accumulation, the thermal resistance of heat sink module was increased; therefore, the size of heat sink should be carefully chosen to match the heat dissipation performance of flat plate heat pipe. Three copper powders, the gas-atomized copper powder (GA), water-atomized copper powder (WA), oxide reduced copper powder (OR) were used to sintering the wick of FPHP, respectively. The thermal performance of wick structure using GA copper powder is the best among three powders.
    Advisor Committee
  • Liu-Ho Chiu - advisor
  • Files indicate access worldwide
    Date of Defense 2006-07-06 Date of Submission 2006-08-08


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