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URN etd-0816105-152013 Statistics This thesis had been viewed 3758 times. Download 2109 times. Author Chih-Hui Chen Author's Email Address No Public. Department Mechanical Engineering Year 2004 Semester 2 Degree Master Type of Document Master's Thesis Language English Page Count 82 Title Comparing of simulation Analysis with injection molding of the Flatness of Precision Electrical Connector Keyword wapage mold flow analysis precision electrical connector Taguchi method Taguchi method precision electrical connector mold flow analysis wapage Abstract As the trend electronics industry goes towards thin, light, short, and small for precision connectors, the techniques have evolved from the earlier through-hole welding of dual in line package (DIP) to printed circuit board (PCB) to surface mount technology (SMT). With this technique in use, the warpage of solder pin of precision electrical connector become the most important product specification. Among the various parameters affecting the warpage of connector’s plastic components, warpage is the most critical. With this in focus, this reserach employs electrical connector which is actually used in the industry as an example and the Taguchi design of experiemnts as means to explore the influences of two different materials, PA6T and LCP, as well as three injection conditions,i.e. injection temperature, injection pressure, and filling-time—on connector warpage. The results show that in the case of PA6T the optimum moulding conditions predicted by mold flow analysis correspond to the actual injection products, yet in the case of LCP the optimum moulding conditions predicted by mold flow analysis differ a little from the actual products. In terms of injection moulding conditions, both materials can obtain optimum warpage at the injection temperature of 315 ℃ and under the injection pressure of 130MPa (for PA6T) and 140MPa (for LCP). The difference is not great. However, as a result of LCP’s better fludity than PA6T’s, LCP’s fill-time only needs 0.9 second and PA6T’s 1.5 seconds. In addition, when the quantity of fiberglass is tested for warpage analysis, it is discovered that the greater the quantity of fiberglass the better the warpage is. Therefore, the quantity of fiberglass seems able to make up for the warpage caused by good fluidity. Yet, in actual application, excess fiberglass will cause difficulty for moulding in practice. Consequently, different injection materials with their respective qualities should go with different injection conditions, and mold flaw analyasis provides an effective evaluation criterion. Advisor Committee Che-Hung Wei - advisor
Chi-Yuan Huang - co-chair
Yung-Kang Shen - co-chair
Files Date of Defense 2005-07-14 Date of Submission 2005-08-16