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URN etd-0816111-132029 Statistics This thesis had been viewed 2068 times. Download 517 times. Author Shu-Wei Chou Author's Email Address No Public. Department Chemical Engineering Year 2010 Semester 2 Degree Master Type of Document Master's Thesis Language English Page Count 110 Title DEVELOPMENT OF AN OXIDIZER-FREE ELECTROLYTE FOR USE IN ELECTROCHEMICAL MECHANICAL PLANARIZATION Keyword Chloride ion Benzotriazole Phosphate electrolyte Electrochemical mechanical planarization Electrochemical mechanical planarization Phosphate electrolyte Benzotriazole Chloride ion Abstract In this study, the introduction of chloride ion (Cl-) in oxidizer-free phosphate electrolytes containing benzotriazole (BTA) was developed for use in electrochemical mechanical planarization (ECMP). According to electrochemical measurements, the inhibition capability of the BTA passive film forming in phosphate electrolyte containing both BTA and Cl- was superior to that forming in BTA-alone electrolyte, even at high anodic potential. The operating potential windows for BTA passive film forming on Cu surface in phosphate electrolyte containing 0.01M BTA without and with 500 ppm Cl- were reached ~1.3 V and ~0.5 V vs. Ag/AgCl. In addition, the results from atomic force microscope (AFM) and secondary ion mass spectrometer (SIMS) show that the thickness of the passive film grown in BTA-containing phosphate electrolyte at 0.3 V vs. Ag/AgCl was ~52±7 nm and ~55 nm, respectively. When phosphate electrolyte both contained BTA and Cl-, the thickness of passive film increased to ~104±18 nm and ~106 nm, respectively. The enhancement of BTA inhibition capability may be due to the increased thickness of passive film grown from the BTA and Cl- electrolyte was thicker than that in BTA-only electrolyte. Furthermore, X-ray photoelectron spectrometer (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation Cl- into BTA passive film and the formation of [Cu(I)Cl(BTA)]4 polymer film on Cu surface. An apparent step height reduction of ~1000nm in Cu pattern structure can be demonstrated in the phosphate electrolyte containing BTA and Cl- at high anodic potential of 1.0 V vs. Ag/AgCl under low downward force (~0.5 psi) for 60s. Therefore, the introduction of Cl- into BTA-containing phosphate electrolyte was effective to enhance the passivation capability of BTA passive film, thus resulting in extending the operating potential window. Advisor Committee Jeng-Yu Lin - advisor
Mu-Rong Yang - co-chair
Shi-Chern Yen - co-chair
Files Date of Defense 2011-07-01 Date of Submission 2011-08-16