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The defense date of the thesis is 2004-08-23
The current date is 2019-04-23
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URN etd-0823104-160152 Statistics This thesis had been viewed 2412 times. Download 14 times. Author Pao-Ching Chou Author's Email Address No Public. Department Mechanical Engineering Year 2003 Semester 2 Degree Master Type of Document Master's Thesis Language English Page Count 92 Title DESIGN AND FABRICATION OF THE REPLACEABLE PACKAGE Keyword Package etching etching Package Abstract The present packaging methods require soldering to connect the signals between the internal and external circuits of the silicon wafer, but if a defect is arisen after the soldering, it will be difficult to recondition the defect and the cost will be increase. In this study, the novel packaging method is presented the easy replacing package provide.
This design primarily uses the characteristic of the lattice direction of the silicon wafer as the packaging frame structure and the cantilever beam structure as the connection line with external signals. These two structures are integrated together into the design of a replaceable packaging device. Firstly, the <100> silicon wafer is etched a cavity of 54.74 degrees by an KOH etchant; and then the solder bump and cantilever beam structure uses the photolithography and electroplate process. The cantilever beam is deposited by electroplating and acts as a path for the circuit transmission. For the bare chip, the bump is deposited by electroplating and acts as a path for the external transmission circuit. At the least, a PI photoresist is used for the fixed seal.
The resistance is 1.7Ω after the packaging and the cantilever beam structure will not be damaged under the decrease and verification of the simulation and theory. It shows that the novel packaging method not only solves the shortcoming of the uneven sizes of the bump but also transmit the electric connection requirements of the package.
Advisor Committee Chao-Heng Chien - advisor
Hung-Shen Guo - co-chair
Jeng- huei Shiu - co-chair
Files Date of Defense 2004-07-16 Date of Submission 2004-08-23