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Title page for etd-0827104-092233


URN etd-0827104-092233 Statistics This thesis had been viewed 1946 times. Download 15 times.
Author Ping-Chi Chiang
Author's Email Address No Public.
Department Mechanical Engineering
Year 2003 Semester 2
Degree Master Type of Document Master's Thesis
Language English Page Count 90
Title The comparison of mechanical properties of diamond-like carbon films under different film thickness and different substrates
Keyword
  • substrate effect
  • nanoindentation
  • DLC
  • DLC
  • nanoindentation
  • substrate effect
  • Abstract The diamond-like carbon (DLC) film comes with many advantages including a high hardness, a low friction coefficient, an excellent chemical corrosion resistance and a good biological compatibility, and thus DLC films are used extensively in wear-resisting protective layers, optical protective layers, and the protective layer for biological inspection chips. Since the thickness of the film approaches 50nm, therefore the mechanical properties of such film of different thicknesses and/or different substrates will affect its performance. The nano indentation test is an important tool for measuring the properties of the film. As the thickness of the film becomes smaller and smaller, understanding the substrate effect on the overall mechanical property is helpful in learning the significance of the complex mechanical property obtained from the Nanoindentation test. The PECVD method is generally adopted to plate silicon on a glass substrate and the nanoindentation test and a Raman spectrometer are used to explore the relation between the DLC bonding ratio and thickness and its way of affecting the coefficient of Young’s modulus and hardness. The results show that there exists a different effect of the thickness on the mechanical property of a DLC film deposited on a different substrate.
    Advisor Committee
  • Chehung Wei - advisor
  • none - co-chair
  • none - co-chair
  • Files indicate in-campus access only
    Date of Defense 2004-07-28 Date of Submission 2004-08-27


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