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The defense date of the thesis is 2018-08-29
The current date is 2019-03-22
This thesis will be accessible at 2019-08-29
URN etd-0829118-172739 Statistics This thesis had been viewed 100 times. Download 0 times. Author Yi-Syun Zeng Author's Email Address No Public. Department Mechanical Engineering Year 2017 Semester 2 Degree Master Type of Document Master's Thesis Language zh-TW.Big5 Chinese Page Count 43 Title Analysis and Design of Heater for Temperature and Displacement Uniformity Keyword Thermal-structural coupling analysis Thermal-structural optimization problem Differential evolution algorithm Differential evolution algorithm Thermal-structural optimization problem Thermal-structural coupling analysis Abstract Temperature control in epitaxy process is a very important parameter in semiconductor process. Temperature changes during the crystallization process affect the quality of the finished product. Better quality of finished products can be achieved by effectively controlling the temperature of the MOCVD heater. In order to approach temperature uniformity during heating process, the off-plane displacement should be maintained uniform to avoid local thermal resistance between heater and heating object.
ANSYS Mechanical APDL was used in thermal-structure coupling analysis of the heater in this study. Differential Evolution(DE) algorithm is integrated with ANSYS thermal-structure coupling analysis for design optimization of MOCVD heater. The goal is to find out the best design of heater with uniformity in temperature and off-plane displacement under design constraints.
Advisor Committee Chun-Yin Wu - advisor
Files Date of Defense 2018-07-20 Date of Submission 2018-08-29