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Title page for etd-0831105-090354


URN etd-0831105-090354 Statistics This thesis had been viewed 3991 times. Download 2729 times.
Author Tsung-Wen Hsieh
Author's Email Address www09240202@yahoo.com.tw
Department Chemical Engineering
Year 2004 Semester 2
Degree Master Type of Document Master's Thesis
Language English Page Count 86
Title CARBON MONOXIDE AND CARBON DIOXIDE ADSORPTION ONTO ACTIVATED CARBON IMPREGNATED COPPER (I) CHLORIDE
Keyword
  • impregnated CuCl activated carbon
  • carbon monoxide
  • carbon dioxide
  • binary adsorption
  • binary adsorption
  • carbon dioxide
  • carbon monoxide
  • impregnated CuCl activated carbon
  • Abstract The single-component adsorption and desorption characteristics of CO and CO2 on the activated carbon impregnated with Copper (I) Chloride in different concentration of HCl solution were measured by fix-bed runs. The characteristics of CuCl impregnated activated carbons were examined by N2 adsorption, SEM, and X-ray. It was found that the impregnation of CuCl effectively increased CO and CO2 adsorption. The effects of CO and CO2 concentration, adsorption temperature, and impregnated HCl concentration were investigated. The CO and CO2 adsorbing capacity of impregnated CuCl activated carbon increases with the increase of CO concentration, CO2 concentration, and impregnated HCl concentration.
    The amounts of CuCl impregnated on the surface of activated carbon were affected by the impregnated HCl concentration, i.e., the solubility of CuCl in HCl solution.
    In the CO/CO2 binary component system, the effluent concentration of CO generally overshoots its inlet concentration during the adsorption steps, and CO2 desorption curves in the desorption steps generally exhibited a plateau region. It may be due to the higher adsorption of CO2 on the impregnated CuCl activated carbon than that of CO.
    Advisor Committee
  • Prof-Chi Wang - advisor
  • Hao-Peng Wan - co-chair
  • Tai-Hsinng Chen - co-chair
  • Files indicate access worldwide
    Date of Defense 2005-07-28 Date of Submission 2005-08-31


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