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URN etd-0902109-134632 Statistics This thesis had been viewed 2865 times. Download 1314 times. Author Pei-Yi Huang Author's Email Address No Public. Department Materials Engineering Year 2008 Semester 2 Degree Master Type of Document Master's Thesis Language English Page Count 52 Title Study of Trench filling behavior of Nano/Micro-Electroplating Keyword filling electroplating electroplating filling Abstract The copper electroplating is studies and applied extensively.
Especially, fill-in copper electroplating plays an important role on printed
circuit boards (PCBs) now because of its connection of those multilayer
boards. Thus, many researchers investigate the improvement of copper
structures. Defects such as seams, voids and vacant spaces may cause
damage to copper structure. Therefore, the quality of copper structures may
affect the performance of electricity and signal transformation.
Traditionally, the method to examine defects is observing the cross-section
by scanning electron microscope (SEM). However, this analysis method
spends much time and is not instantaneous. Thus, real-time X-ray
microradiography (TXM) is employed to observe the behavior during copper
electroplating, which can provide a convenient and directly real-time
observation of different aspect ratio photo-resist microstructure without
destruction. With the results from using real-time X-ray microradiography
could be used to make high aspect ratio gold structure in nano-scale.
Advisor Committee Hong-Ming Lin - advisor
Yeu-Kuang Hwu - advisor
C.K. Lin - co-chair
She-Huang Wu - co-chair
Wen-Chang Chen - co-chair
Files Date of Defense 2009-07-06 Date of Submission 2009-09-07