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Title page for etd-0902109-134632


URN etd-0902109-134632 Statistics This thesis had been viewed 2911 times. Download 1314 times.
Author Pei-Yi Huang
Author's Email Address No Public.
Department Materials Engineering
Year 2008 Semester 2
Degree Master Type of Document Master's Thesis
Language English Page Count 52
Title Study of Trench filling behavior of Nano/Micro-Electroplating
Keyword
  • filling
  • electroplating
  • electroplating
  • filling
  • Abstract The copper electroplating is studies and applied extensively.
    Especially, fill-in copper electroplating plays an important role on printed
    circuit boards (PCBs) now because of its connection of those multilayer
    boards. Thus, many researchers investigate the improvement of copper
    structures. Defects such as seams, voids and vacant spaces may cause
    damage to copper structure. Therefore, the quality of copper structures may
    affect the performance of electricity and signal transformation.
    Traditionally, the method to examine defects is observing the cross-section
    by scanning electron microscope (SEM). However, this analysis method
    spends much time and is not instantaneous. Thus, real-time X-ray
    microradiography (TXM) is employed to observe the behavior during copper
    electroplating, which can provide a convenient and directly real-time
    observation of different aspect ratio photo-resist microstructure without
    destruction. With the results from using real-time X-ray microradiography
    could be used to make high aspect ratio gold structure in nano-scale.
    Advisor Committee
  • Hong-Ming Lin - advisor
  • Yeu-Kuang Hwu - advisor
  • C.K. Lin - co-chair
  • She-Huang Wu - co-chair
  • Wen-Chang Chen - co-chair
  • Files indicate in-campus access immediately and off-campus access at one year
    Date of Defense 2009-07-06 Date of Submission 2009-09-07


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