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The defense date of the thesis is 2014-09-09
The current date is 2019-07-19
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URN etd-0909114-151243 Statistics This thesis had been viewed 1349 times. Download 0 times. Author Peng-Yu Chen Author's Email Address No Public. Department Chemical Engineering Year 2013 Semester 2 Degree Master Type of Document Master's Thesis Language zh-TW.Big5 Chinese Page Count 93 Title PRETREATMENT OF SILICON SOLAR WAFER AFTER DIAMOND WIRE SLICING Keyword Texturization Multi-crystalline silicon Etching Etching Multi-crystalline silicon Texturization Abstract In recent years, silicon-panel solar cell is still the mainstream in the solar cell market with multi-crystalline silicon being the largest share. There are mainly two types of slicing processes, wire saw slicing and diamond wire slicing that result in different efficiencies of solar cells. The wire saw slicing method has a lower cost, but the diamond wire slicing has a higher productivity and the wire material has relatively higher durability. Therefore, the diamond wire slicing process becomes the mainstream and its development cannot be ignored. However, the lattice structure of silicon has different degrees of damage when the diamond wire slicing was applied. The surface roughness of diamond wire cutting was inadequate after etching process because the produced silicon wafers have higher reflectivity and lower efficiency. Therefore, this study uses hydrofluoric acid, nitric acid and sulfuric acid with different proportions for the purpose of finding the best etchant recipe to increase the surface roughness of the diamond wire cutting wafers for more stringent customers’ demand. Advisor Committee Jia-Ming Chern - advisor
Files Date of Defense 2014-07-14 Date of Submission 2014-09-09