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Title page for etd-0909114-151243


URN etd-0909114-151243 Statistics This thesis had been viewed 1253 times. Download 0 times.
Author Peng-Yu Chen
Author's Email Address No Public.
Department Chemical Engineering
Year 2013 Semester 2
Degree Master Type of Document Master's Thesis
Language zh-TW.Big5 Chinese Page Count 93
Title PRETREATMENT OF SILICON SOLAR WAFER AFTER DIAMOND WIRE SLICING
Keyword
  • Texturization
  • Multi-crystalline silicon
  • Etching
  • Etching
  • Multi-crystalline silicon
  • Texturization
  • Abstract In recent years, silicon-panel solar cell is still the mainstream in the solar cell market with multi-crystalline silicon being the largest share. There are mainly two types of slicing processes, wire saw slicing and diamond wire slicing that result in different efficiencies of solar cells. The wire saw slicing method has a lower cost, but the diamond wire slicing has a higher productivity and the wire material has relatively higher durability. Therefore, the diamond wire slicing process becomes the mainstream and its development cannot be ignored. However, the lattice structure of silicon has different degrees of damage when the diamond wire slicing was applied. The surface roughness of diamond wire cutting was inadequate after etching process because the produced silicon wafers have higher reflectivity and lower efficiency. Therefore, this study uses hydrofluoric acid, nitric acid and sulfuric acid with different proportions for the purpose of finding the best etchant recipe to increase the surface roughness of the diamond wire cutting wafers for more stringent customers’ demand.
    Advisor Committee
  • Jia-Ming Chern - advisor
  • Files indicate in-campus access at 5 years and off-campus not accessible
    Date of Defense 2014-07-14 Date of Submission 2014-09-09


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